News | Monday, 5 December 2022
The Plastics Innovation Competence Center is INVITING you to the EMPACK fair (Innovations for packaging along the entire value chain).
When : January 25 & 26, 2023.
Where : Zürich
Which stand : stand A14, Halle 3 in the Science Expérience Area
R.J. Koopmans from the Plastics Innovation Competence Center and Roger Marti from the ChemTech Institute of College of Engineering and Architecture of Fribourg (HEIA-FR)
will present BIOBASED SMART PACKAGINGS.
Please REGISTER using the below link. Using this link will enable you to enter the trade fair free of charge.
